| Site: | Samsung Electronics |
|---|---|
| Manufacturer: | HPE |
| Cores: | 11,200 |
| Processor: | Xeon Gold 6430 32C 2.1GHz |
| Interconnect: | Infiniband NDR400 |
| Installation Year: | 2024 |
| Performance | |
| Linpack Performance (Rmax) | 3.82 PFlop/s |
| Theoretical Peak (Rpeak) | 4.84 PFlop/s |
| Nmax | 860,160 |
| Power Consumption | |
| Power: | 68.98 kW (Optimized: 42.78 kW) |
| HPL of optimized run | 2.88 PFlop/s |
| Power Measurement Level: | 2 |
| Software | |
| Operating System: | RHEL 9.2 |
| Compiler: | NVIDIA CUDA 12.6 |
| Math Library: | NVIDIA CUDA 12.6 |
| MPI: | nccl-2.22.3, Open MPI 4.1.7a1 |
| List | Rank | System | Vendor | Total Cores | Rmax (PFlop/s) | Rpeak (PFlop/s) | Power (kW) |
|---|---|---|---|---|---|---|---|
| 06/2025 | 304 | HPE Cray XD670, Xeon Gold 6430 32C 2.1GHz, NVIDIA H100 SXM5 80GB, Infiniband NDR400, RHEL 9.2 | HPE | 11,200 | 3.82 | 4.84 | 68.98 |